TUF0060 is an adhesive with exceptional thermal conductivity specifically designed for underfill applications in chip packaging. It significantly enhances the chip's heat dissipation efficiency. Additionally, it strengthens the bond between the chip and the PCB, bolstering the long-term reliability of the chip.

TUF0140 is an adhesive with exceptional thermal conductivity specifically designed for underfill applications in chip packaging. It significantly enhances the chip's heat dissipation efficiency. Additionally, it strengthens the bond between the chip and the PCB, bolstering the long-term reliability of the chip.

UF0011 is an underfill designed for applications in chip packaging. It strengthens the bond between the chip and the PCB, bolstering the long-term reliability of the chip.