TUF0060
TUF0060 is an adhesive with exceptional thermal conductivity specifically designed for underfill applications in chip packaging. It significantly enhances the chip's heat dissipation efficiency. Additionally, it strengthens the bond between the chip and the PCB, bolstering the long-term reliability of the chip.
Product Features
High Thermal Conductivity
Low CTE
Low Viscosity
High Reliability
Property
特性
Typical Value
典型值
Unit
单位
Test Method
测试方法
Composition 主要成份
Epoxy Filled with Alumina
氧化铝粉体填充环氧树脂
Color 颜色
Off White 米白色
Visual 目视
Thermal Conductivity 导热系数 0.6 W/m·K ASTM D5470
Viscosity 粘度
5000
mPa·s
CP51, 25°C
Speed 20 rpm
Density 密度
1.85
g/cm3
ASTM D792
Cure Schedule 固化条件
3min@150℃
Tg 玻璃化转变温度
110 °C TMA
CTE 热膨胀系数
50 & 140
ppm/°C
TMA
Storage Modulus 储能模量
5.0 Gpa DMA
Die Shear Strength 粘接强度
10 Kg
3*3mm2 Sion FR4
Pot Life 使用期
3 Day 25°C

Shelf Life 保存期

6 month
-20℃
RoHS Compliance 合规性
YES