Low Hardness High Resilience
High thermal conductivity with low hardness (Shore 00 15-70)
Adaptive to structural assembly with low compression resistance
High Reliability
The materials passed reliability tests in automotive, aerospace, telecommunication, consumer electronics according to customers' requirements
High Thermal Conductivity
Thermal conductivity: 1.0-35.0W/(m·K)
Extremely low/ No Oil Bleeding
Silicone oil-bleeding less than 1%, avoiding silicone oil pollution to components
Conventional Thermal Gap Pad
Conventional thermal gap pad products exhibit double-sided natural tackiness. The material can build up a good heat conduction path between the heat sink and the metal substrate during assembly. The product shows low thermal resistance and good electrical insulation properties under low compression force.
Product Features
• High Thermal Conductivity
• Good Toughness
• High Breakdown Voltage
• Good Resilience
• Superior High-Temperature Stability
Ultra-Soft Thermal Gap Pad
Ultra-soft thermal gap pad exhibits lower hardness compared with conventional thermal gap pad, offering higher compression ratio at equivalent pressure. It's suitable for applications requiring low assembly stress, variable gap tolerance, high surface roughness or uneven surface.
Product Features
• High Thermal Conductivity
• Low Hardness
• Superior Compression Performance
• Good Resilience
High Thermal Conductivity Gap Pad
High thermal conductivity gap pad products exhibit double-side natural tackiness feature for easy assembly. Die cut dimensions can be applied according to customer’s requirement with thickness above 0.5mm. Based on ceramic filler system, the material possess high thermal conductivity, low thermal resistance as well as excellent insulation performance.
Product Features
• High Thermal Conductivity
• High Cost Effectiveness
• Excellent Reliability
• Good Insulation Performance