Low Stress
Thixotropic paste. Adaptive to various interface tolerance with low assembling stress
Low Density
20% lower in density for some special products than conventional products with similar thermal performance
High Thermal Conductivity
Thermal conductivity from 1.5 to 12.0 W/(m·K)
High Reliability
Excellent long-term reliability in high-temperature, thermal shock, thermal cycle tests
One-Component Thermal Gel
One-Component thermal gel is a kind of product with high thermal conductivity, low compression stress and excellent reliability performance. The material provides good gap filling ability and could be used for automatic dispensing and screen printing.