In the era of data explosion, computing power serves as the core engine driving innovation, while heat dissipation capability directly determines the stability and efficiency of computing power.

Zhongnuo's high-performance thermal interface materials are the cornerstone for the stable operation of data centers. They are precisely applied between high heat flux density chips such as CPUs, GPUs, and memories, and heat sinks, providing reliable and efficient cooling support for cutting-edge fields such as cloud computing and artificial intelligence.