To address the issues of overheating, frequency reduction, performance limitation, and reliability challenges caused by the "explosive growth of heat flux density" in semiconductor chips.

Zhongnuo's cutting-edge thermal interface materials are the "performance keys" that unlock the ultimate potential of chips. They are precisely applied between high-end chips such as CPUs, GPUs, and AI accelerators and heat sinks, establishing an extremely efficient thermal conduction pathway to quickly dissipate the huge heat generated on the wafer. With professional and rigorous thermal management solutions, they support the continuous advancement of the semiconductor industry and provide the performance foundation for the next generation of electronic devices.