In the field of smart home appliances, continuous connectivity, high-performance computing, and high integration have become mainstream trends, imposing stringent demands on thermal management capabilities for long-term operation.

Zhongnuo's new thermal interface materials efficiently conduct and dissipate heat, ensuring core components operate stably at normal temperatures and preventing performance throttling or device failures caused by overheating. Widely applied in critical components such as heat sinks, heat spreaders, and thermal conductive adhesives, these materials efficiently dissipate heat generated by main control chips and power modules. This ensures devices maintain stable performance, controlled energy consumption, and extended lifespan during 24/7 continuous operation.Translated with DeepL.com (free version)