High Thermal Conductivity Gap Pad
Thermal CFP2000-US
Thermal CFP2000-US carbon fiber based high thermal conductive gap pad is designed based on carbon fiber orientation technology with thermal conductivity of 20.0W/m.K. The product provides good mechanical properties, as well as excellent gap filling ability to improve chip dissipation efficiency.
Product Features
Thermal Conductivity 20.0 W/m·K
Low Compress Stress
High Rebound Performance
High Reliability
Property
特性
Typical Value
典型值
Unit
单位
Test Method
测试方法
Composition 主要成份

Silicone Filled with Carbon Filler and Thermal Powder 硅胶&碳纤维&导热粉体

Color 颜色

Dark Gray 深灰色

Visual 目视
Thermal Conductivity 导热系数 20.0 W/m·K ASTM D5470
Thickness 厚度 0.3 - 5.0 mm ASTM D374
Hardness 硬度(Shore 00) 35 ASTM D2240
Density 密度 1.9 g/cm3 ASTM D792

Temperature Range 耐温范围

-40 - 200 °C

Breakdown Voltage 击穿强度

< 100 V/mm ASTM D149

Volume Resistivity 体积电阻率

< 500 Ω.cm ASTM D257

Dielectric Constant 介电常数

5.18@10MHz ASTM D150

Flame Rating 阻燃等级

V-0 UL 94

RoHS Compliance 合规性

YES

Shelf Life 保存期

24 month 25±5°C≤50%RH