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Thermal Gap Filling Material
Thermal Gap Pad
One-Component Thermal Conductive Gel
Two-Component Thermal Conductive Gap Filler
Micro-Thermal Interface Material
Thermal Grease
Durable TIM Material
Phase Change Material
Electromagnetic Compatible Material
Electrically Conductive Gel
Heat Storage Material
Heat Storage Gap Pad
Heat Storage Gel
Thermal Conductive Potting Material
Thermal Conductive Potting Material
Bonding Materials
Underfill
Active Alignment
Structural Adhesive
Solutions
Consumer Electronics and End Devices Drone Home and Commercial Appliances Wireless Communication System Data Infrastructure Semiconductor Car New Energy Facilities Power and Industrial Automation
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Home
About Us
Company Profile R&D Capability Manufacturing Quality Control
Products
Thermal Gap Filling Material
Thermal Gap Pad
One-Component Thermal Conductive Gel
Two-Component Thermal Conductive Gap Filler
Micro-Thermal Interface Material
Thermal Grease
Durable TIM Material
Phase Change Material
Electromagnetic Compatible Material
Electrically Conductive Gel
Heat Storage Material
Heat Storage Gap Pad
Heat Storage Gel
Thermal Conductive Potting Material
Thermal Conductive Potting Material
Bonding Materials
Underfill
Active Alignment
Structural Adhesive
Solutions
Consumer Electronics and End Devices Drone Home and Commercial Appliances Wireless Communication System Data Infrastructure Semiconductor Car New Energy Facilities Power and Industrial Automation
News
Contact Us
CN
TUF0140
TUF0140
TUF0140 是一种具有导热能力的底部填充胶，可以极大地提高芯片 的散热效率，增强芯片与 PCB 板之间的粘接力，提升芯片的长期使用可 靠性。
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Product Features
高导热
低粘度
低密度
高可靠性