Thermal Potting
Thermal TP0200LD
Thermal TP0200LD thermally conductive potting compound is a two-component additional type silicone base with high thermal conductivity, good flowability, low density, superior electrical insulation and flame retardancy. It’s suitable for high-power devices such as high-power supplies and modules, current/power conversion units, high power on-board chargers and charging piles. The product can meet the requirements for high thermal conductivity in the electrical/electronic packaging field and maintaining silicone polymer characteristics.
Product Features
Low Viscosity
Low Density
Easy Handling
High Reliability
Property
特性
Typical Value
典型值
Unit
单位
Test Method
测试方法
Composition 主要成

Silicone Filled with Thermal Powder 硅胶&导热粉体

   
Color 颜色

A–Gray 灰色
B–White 白色
Mix–Gray 灰色

Visual 目视

Viscosity 粘度 (A/B)

5000 ± 1000

mPa.s ASTM D2196
Hardness 硬度(Shore A) 30 ± 10 ASTM D2240
Density 密度 2.0 ± 0.1 g/cm3 ASTM D792

Tacky-Free Time 表干时间

>= 30min @ RT

Cure Time 固化时间

24H @ RT15min @ 150°C

Temperature Range 耐温范围

-40 - 150 °C

Breakdown Voltage 击穿强度

>= 8.0 KV/mm ASTM D149

Flame Rating 阻燃等级

V-0 UL 94
RoHS Compliance 合规性 YES
Shelf Life 保存期 6 month 25±5°C, ≤50% RH