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Thermal Management Emerges as New Bottleneck for Chip Computing Power? Zhongnuo Unveils Next-Generation Thermal Interface Materials to Break Through Performance Ceilings Zhongnuo Unveils Next-Generation Thermal Interface Materials to Break Through Performance Ceilings“ ”Has Thermal Management Become the New Bottleneck for Chip Computing Power? Zhongnuo Unveils Next-Generation Thermal Interface Materials to Break Through Performance Ceilings“ ”Has Thermal Management Become the New Bottleneck for Chip Computing Power? Zhongnuo Unveils Next-Generation Thermal Interface Materials to Break Through Performance Ceilings“ ”Has Thermal Management Become the New Bottleneck for Chip Computing Power? Zhongnuo Unveils Next-Generation Thermal Interface Materials to Break Through Performance Ceilings"